Reducing size and increasing power capabilities of electronic devices is of major importance for the overall performance of any satellite. Higher strength of the signals for Navigation applications and higher throughput in telecommunication satellites are pushing towards higher power density at payload subsystems. Currently there is a large maturity gap between GaN or Silicon Carbide components and thermal management solutions at assembly or package level. Most of available packaging solutions are from Japan or the US only, and not necessarily suitable for space applications in terms of reliability and/or performance.


Is the European effort to develop the next generation of low thermal resistance packages, in particular thanks to the implementation of state-of-the-art diamond based composite materials and disruptive new heat sinking solutions. In order to secure a supply chain for packages and ensure the non‐dependence and competitiveness at European level, 9 partners from 7 different countries will collaborate in the frame of HEATPACK. Space level reliability of the developed solutions as well as their commercial viability will be demonstrated within the frame of the project.



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The first Year Review Meeting of the project was held February 20th and 21st in RHP premises located at Seibersdorf. Project results of the first year were presented by all the partners to the European Commission showing the good progress that has been achieved on the development of the high thermal dissipation packages.
HEATPACK project was presented by TAS at the European GaN for Space Applications Workshop held at the Research Executive Agency of the European Commission in Brussels.
The two telecommunications satellites EUTELSAT KONNECT (manufactured by Thales Alenia Space) and GSAT-30 (manufactured by ISRO) were launched Arianespace’s Ariane 5 and put in geostationary transfer orbit successfully in its first 2020 mission.

“This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 821963”