Abstract

Reducing size and increasing power capabilities of electronic devices is of major importance for the overall performance of any satellite. Higher strength of the signals for Navigation applications and higher throughput in telecommunication satellites are pushing towards higher power density at payload subsystems. Currently there is a large maturity gap between GaN or Silicon Carbide components and thermal management solutions at assembly or package level. Most of available packaging solutions are from Japan or the US only, and not necessarily suitable for space applications in terms of reliability and/or performance.

What is HEATPACK

Is the European effort to develop the next generation of low thermal resistance packages, in particular thanks to the implementation of state-of-the-art diamond based composite materials and disruptive new heat sinking solutions. In order to secure a supply chain for packages and ensure the non‐dependence and competitiveness at European level, 9 partners from 7 different countries will collaborate in the frame of HEATPACK. Space level reliability of the developed solutions as well as their commercial viability will be demonstrated within the frame of the project.

100

%

Best practices

24

participants

110

person months

1

Years of Service

Latest News

HEATPACK project was presented at the “les Journées de Palaiseau - Electronic Packaging & Interconnect” on 10 September 2020, an event gathering more than 100 people from the different Thales entities. This one-day conference provided an opportunity to address the Thales group's advances and roadmap in electronic packaging, and to tackle main related issues such as the thermal management of power components and modules, for which HEATPACK intends to propose key enabling solutions.
HEATPACK project was presented at the XIX National Electronic Conference in Darłówko Wschodnie (Poland). WUT disseminated HEATPACK technologies in the frame of the presentation related to their work performing thermal and mechanical characterization of Ag pastes used for GaN-on-Si chips assembly onto Cu substrates.
The first Year Review Meeting of the project was held February 20th and 21st in RHP premises located at Seibersdorf. Project results of the first year were presented by all the partners to the European Commission showing the good progress that has been achieved on the development of the high thermal dissipation packages.

“This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 821963”