Heatpack
Heatpack
  • Home
  • Project
  • Key Technologies
    • WHY ACTIVE COOLING
    • WHY DIAMONDS
    • WHY NANOPARTICLES?
  • Consortium
  • Future Events
  • News
    • Home
    • Project
    • Key Technologies
      • WHY ACTIVE COOLING
      • WHY DIAMONDS
      • WHY NANOPARTICLES?
    • Consortium
    • Future Events
    • News

News

Browse:

  • Home
  • News
16 mayo, 2022 expomark

FDTR Technique presented at CSMantech workshop

Presentation of the novel low-frequency frequency-domain thermoreflectance (FDTR) instrument was carried out at CSMantech by University of Bristol partner of…

  • Sin categoría
12 abril, 2022 expomark

MSG-1 Record for Orbital Longevity

MSG-1 Satellite built by TAS operated by EUMETSAT was put in orbit by August 2002 and has now broken all…

  • Sin categoría
27 octubre, 2021 expomark

HEATPACK article published at EU Research magazine

HEATPACK article has been published at EU Research magazine. Satellites today generate large amounts of heat, have more capacity and…

  • Sin categoría
21 octubre, 2021 expomark

HEATPACK at CSEM SCIENTIFIC & TECHNICAL REPORT 2020

Each year CSEM (Centre Suisse d’Electronique et de Microtechnique) publishes its Scientific & Technical Report. Scientific and Technical Report 2020…

  • Sin categoría
21 julio, 2021 expomark

HELLAS-3 SAT 5G Satellite Backhauling

Hellas Sat carried out an experiment consisting in backhauling the connection between a 5G Core Network and a 5G gNB…

  • Sin categoría
12 febrero, 2021 expomark

TAS to build 298- satellite constellation LIGHTSPEED

Thales Alenia Space, has signed an agreement with leading global satellite operator Telesat to be the prime contractor on the…

  • Sin categoría
11 septiembre, 2020 expomark

TAS’s Les Journées de Palaiseau EP&I

HEATPACK project was presented at the “les Journées de Palaiseau – Electronic Packaging & Interconnect” on 10 September 2020, an event gathering more than 100 people from the different Thales entities. This one-day conference provided an opportunity to address the Thales group’s advances and roadmap in electronic packaging, and to tackle main related issues such as the thermal management of power components and modules, for which HEATPACK intends to propose key enabling solutions.

  • Sin categoría
3 septiembre, 2020 Juan Moreno Echarri

HEATPACK at XIX National Electronic Conference in Darłówko Wschodnie

HEATPACK project was presented at the XIX National Electronic Conference in Darłówko Wschodnie (Poland). WUT disseminated HEATPACK technologies in the frame of the presentation related to their work performing thermal and mechanical characterization of Ag pastes used for GaN-on-Si chips assembly onto Cu substrates.

  • Sin categoría
  • HEATPACK, Ag Sintering, Ag Paste, GaN
4 mayo, 2020 expomark

First Year Review Meeting of HEATPACK held at Seibersdorf

The first Year Review Meeting of the project was held February 20th and 21st in RHP premises located at Seibersdorf. Project results of the first year were presented by all the partners to the European Commission showing the good progress that has been achieved on the development of the high thermal dissipation packages.

  • Sin categoría
29 enero, 2020 expomark

Heatpack at European GaN for Space Applications Workshop

HEATPACK project was presented by TAS at the European GaN for Space Applications Workshop held at the Research Executive Agency of the European Commission in Brussels.

  • Sin categoría

Navegación de entradas

1 2 Siguientes
Heatpack

    © 2019 Metech. All Rights Reserved.

    • Home
    • Project
    • Key Technologies
      • WHY ACTIVE COOLING
      • WHY DIAMONDS
      • WHY NANOPARTICLES?
    • Consortium
    • Future Events
    • News