Each year CSEM (Centre Suisse d’Electronique et de Microtechnique) publishes its Scientific & Technical Report. Scientific and Technical Report 2020…
HEATPACK project was presented at the “les Journées de Palaiseau – Electronic Packaging & Interconnect” on 10 September 2020, an event gathering more than 100 people from the different Thales entities. This one-day conference provided an opportunity to address the Thales group’s advances and roadmap in electronic packaging, and to tackle main related issues such as the thermal management of power components and modules, for which HEATPACK intends to propose key enabling solutions.
HEATPACK project was presented at the XIX National Electronic Conference in Darłówko Wschodnie (Poland). WUT disseminated HEATPACK technologies in the frame of the presentation related to their work performing thermal and mechanical characterization of Ag pastes used for GaN-on-Si chips assembly onto Cu substrates.
The first Year Review Meeting of the project was held February 20th and 21st in RHP premises located at Seibersdorf. Project results of the first year were presented by all the partners to the European Commission showing the good progress that has been achieved on the development of the high thermal dissipation packages.
The two telecommunications satellites EUTELSAT KONNECT (manufactured by Thales Alenia Space) and GSAT-30 (manufactured by ISRO) were launched Arianespace’s Ariane 5 and put in geostationary transfer orbit successfully in its first 2020 mission.
The first Steering Committee Meeting (SCM#1) of the project was held the days 9 and 10 of July in Warsaw University of Technology (WUT). Project results up to date were presented by all the partners showing the good progress that has been achieved on the development of the packages critical building blocks (TIM1, TIM2, diamond-based composites and micro heat pipes).