HEATPACK project was presented at the XIX National Electronic Conference in Darłówko Wschodnie (Poland). WUT disseminated HEATPACK technologies in the frame of the presentation related to their work performing thermal and mechanical characterization of Ag pastes used for GaN-on-Si chips assembly onto Cu substrates.
The first Year Review Meeting of the project was held February 20th and 21st in RHP premises located at Seibersdorf. Project results of the first year were presented by all the partners to the European Commission showing the good progress that has been achieved on the development of the high thermal dissipation packages.
HEATPACK project was presented by TAS at the European GaN for Space Applications Workshop held at the Research Executive Agency of the European Commission in Brussels.
The two telecommunications satellites EUTELSAT KONNECT (manufactured by Thales Alenia Space) and GSAT-30 (manufactured by ISRO) were launched Arianespace’s Ariane 5 and put in geostationary transfer orbit successfully in its first 2020 mission.
The first Steering Committee Meeting (SCM#1) of the project was held the days 9 and 10 of July in Warsaw University of Technology (WUT). Project results up to date were presented by all the partners showing the good progress that has been achieved on the development of the packages critical building blocks (TIM1, TIM2, diamond-based composites and micro heat pipes).
Yamal-601 communications satellite now started the in orbit raising phase
ORIONAS is a European R&D project aiming to develop the next generation low-C-SWAP lasercom modems enabling >50 Gb/s satellite constellation…
ADAMANT, partner of HEATPACK consortium participated in the Patras Innovation Quest (Patras IQ, 12-14 April 2019, Patras). A HEATPACK’s project…