HEATPACK project was presented at the “les Journées de Palaiseau – Electronic Packaging & Interconnect” on 10 September 2020, an event gathering more than 100 people from the different Thales entities. This one-day conference provided an opportunity to address the Thales group’s advances and roadmap in electronic packaging, and to tackle main related issues such as the thermal management of power components and modules, for which HEATPACK intends to propose key enabling solutions.