RF package
LF package
Development of critical packaging building blocks for performance and reliability of high power space components:
- Very high thermal conductivity diamond based composite material
- First level Thermal Interface Material based on nano‐silver (TIM1)
- Second level Thermal Interface Material (TIM2)
- Embedded micro heat pipes for in‐situ cooling
- High power hermetic RF micro-package
- High power LF package
Demonstration of the technologies:
- High power high frequency hermetic micropackage
- High power “low frequency” package dedicated to power switching applications
Design and test of two demonstrators implementing GaN based functions, using the packages developed :
- RF HPA module delivering up to 400W
- Power switching module with up to 700Wdc nominal output power
Preliminary evaluation of both modules against space constraints