HEATPACK project was presented by TAS at the European GaN for Space Applications Workshop held at the Research Executive Agency of the European Commission in Brussels.
Almost 50 attendees, representing European GaN RF and Power industries/foundries, end-users, research institutes, universities, Space agencies, EU institutions were present.
Presentations and round tables have raised several important and critical elements that require attention for the future of GaN technology, in particular the need for improved thermal management solutions to fully harness the potential of wide-bandgap components, the core topic of HEATPACK.