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Autor: Juan Moreno Echarri

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26 septiembre, 2022 Juan Moreno Echarri

HEATPACK at 15th International Symposium on Materials in the Space Environment (ISMSE)

ADAMANT, partner of HEATPACK consortium participated in the ISMSE congress. A HEATPACK’s project poster was presented in this workshop explaining…

  • Sin categoría
5 agosto, 2022 Juan Moreno Echarri

High performance SES-22 C-Band Satellite Launched

The first SES-22 satellite built by Thales Alenia Space was successfully deployed. This satellite aims to deliver TV and radio…

  • Sin categoría
16 mayo, 2022 Juan Moreno Echarri

FDTR Technique presented at CSMantech workshop

Presentation of the novel low-frequency frequency-domain thermoreflectance (FDTR) instrument was carried out at CSMantech by University of Bristol partner of…

  • Sin categoría
12 abril, 2022 Juan Moreno Echarri

MSG-1 Record for Orbital Longevity

MSG-1 Satellite built by TAS operated by EUMETSAT was put in orbit by August 2002 and has now broken all…

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27 octubre, 2021 Juan Moreno Echarri

HEATPACK article published at EU Research magazine

HEATPACK article has been published at EU Research magazine. Satellites today generate large amounts of heat, have more capacity and…

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21 octubre, 2021 Juan Moreno Echarri

HEATPACK at CSEM SCIENTIFIC & TECHNICAL REPORT 2020

Each year CSEM (Centre Suisse d’Electronique et de Microtechnique) publishes its Scientific & Technical Report. Scientific and Technical Report 2020…

  • Sin categoría
21 julio, 2021 Juan Moreno Echarri

HELLAS-3 SAT 5G Satellite Backhauling

Hellas Sat carried out an experiment consisting in backhauling the connection between a 5G Core Network and a 5G gNB…

  • Sin categoría
12 febrero, 2021 Juan Moreno Echarri

TAS to build 298- satellite constellation LIGHTSPEED

Thales Alenia Space, has signed an agreement with leading global satellite operator Telesat to be the prime contractor on the…

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11 septiembre, 2020 Juan Moreno Echarri

TAS’s Les Journées de Palaiseau EP&I

HEATPACK project was presented at the “les Journées de Palaiseau – Electronic Packaging & Interconnect” on 10 September 2020, an event gathering more than 100 people from the different Thales entities. This one-day conference provided an opportunity to address the Thales group’s advances and roadmap in electronic packaging, and to tackle main related issues such as the thermal management of power components and modules, for which HEATPACK intends to propose key enabling solutions.

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3 septiembre, 2020 Juan Moreno Echarri

HEATPACK at XIX National Electronic Conference in Darłówko Wschodnie

HEATPACK project was presented at the XIX National Electronic Conference in Darłówko Wschodnie (Poland). WUT disseminated HEATPACK technologies in the frame of the presentation related to their work performing thermal and mechanical characterization of Ag pastes used for GaN-on-Si chips assembly onto Cu substrates.

  • Sin categoría
  • HEATPACK, Ag Sintering, Ag Paste, GaN

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Entradas recientes

  • Diamond Composite Characterization paper published in ACS Journal
  • HEATPACK Final Review in TAS Toulouse
  • HEATPACK at CS Mantech
  • HEATPACK at 15th International Symposium on Materials in the Space Environment (ISMSE)
  • High performance SES-22 C-Band Satellite Launched

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